The system is applicable to the cutting of large-format electronic glass.
Glass incoming mode: bench incoming
Applicable product size: ≤ 1830mm * 2440mm, product thickness: 0.7mm-6mm
Working process: glass bench incoming material - automatic loading of the tipping machine - glass cleaning and drying - glass center positioning - laser cutting - laser splitting - automatic sorting of finished products (automatic waste removal of glass) - rear end transportation of finished products (automatic or manual insertion of the rack by the customer).
The system is applicable to the cutting of large-format electronic glass.
Glass incoming mode: bench incoming
Applicable product size: ≤ 1830mm * 2440mm, product thickness: 0.7mm-6mm
Working process: glass bench incoming material - automatic loading of the tipping machine - glass cleaning and drying - glass center positioning - laser cutting - laser splitting - automatic sorting of finished products (automatic waste removal of glass) - rear end transportation of finished products (automatic or manual insertion of the rack by the customer).
The applicable object parameters of the system are as follows:
Machining object | Electronic glass |
Product thickness | 0.7mm-6mm |
Product size | ≤ 1830mm*2440mm |
Dimensions after cutting | ≥ 113mm*76mm (depending on the specific material) |
For the applicable objects indicated in the table, the process capacity is shown in the following table:
Product positioning accuracy | ≤±25μm |
Spot diameter | ≤ 3 μm |
Repetitive machining accuracy | ≤±3 μm |
Edge collapse amount | ≤ 0.1 mm |
CCD alignment size | 1830mm*2440mm |
Positioning method | CCD automatic positioning |
Cutting speed | ≤100 mm/s (depending on the specific material) |
Split velocity | ≤100 mm/s (depending on the specific material) |
The applicable object parameters of the system are as follows:
Machining object | Electronic glass |
Product thickness | 0.7mm-6mm |
Product size | ≤ 1830mm*2440mm |
Dimensions after cutting | ≥ 113mm*76mm (depending on the specific material) |
For the applicable objects indicated in the table, the process capacity is shown in the following table:
Product positioning accuracy | ≤±25μm |
Spot diameter | ≤ 3 μm |
Repetitive machining accuracy | ≤±3 μm |
Edge collapse amount | ≤ 0.1 mm |
CCD alignment size | 1830mm*2440mm |
Positioning method | CCD automatic positioning |
Cutting speed | ≤100 mm/s (depending on the specific material) |
Split velocity | ≤100 mm/s (depending on the specific material) |