LASER ETCHING & CUTTING

The laser beam can be focused into Φ With a light spot of 0.01 mm or less, an energy density of 108 W/cm2 to 1010 W/cm2 and a local high temperature of 10000 ℃ are obtained, which rapidly melts, vaporizes, or undergoes chemical changes in the processed material. The molten material is ejected in the form of a shock wave, enabling cutting or engraving.

Laser etching machine is a professional equipment that uses the interaction between laser and materials to segment conductive lines (indium tin oxide, silver powder, etc.), thereby achieving the layout of the touch panel sensor layout, and performing touch screen line etching.

Suitable for etching the visible area and wire area of capacitive touch screens with a width of less than 120 inches.

Its characteristics are as follows:

Application efficiency: One machine can be used for multiple purposes, while processing various new materials such as ITO, silver paste, graphene, nano silver, carbon nanotubes, etc;

Processing efficiency: Multi galvanometer processing, high processing efficiency, high yield;

It can fully meet the differentiated needs of customers, support flexible customization, and expand well. It supports multiple loading and unloading methods such as roll to roll, truss, and multi-axis robot. It can achieve no adsorption within the etched surface of the touch screen, without damaging the effective area, and reduce defects caused by product pollution.

The etching line width can reach a minimum of 20 microns to achieve a large screen and narrow border.