Equipment compatible product size: ≤ 800mm × 600 mm, applicable to etching of 21 inch wide materials and below capacitive touch screen visual area and wire area
The equipment configuration adopts a dual optical path system to realize high-speed synchronous etching of small and medium-sized touch screen lines with thin line width, which increases the etching efficiency of the equipment by 50%~80%.
The software control has the function of intelligent data blocking to meet the requirements of special-shaped typesetting, improve the use efficiency of materials, and reduce the loss of materials.
Double CCD automatic correction, various correction methods, ensure the accuracy of etching and meet customer needs;
Etching line pitch can reach below 20 microns, which can be etched with ultra-fine line width silver paste, meeting the customer's demand for narrow frame touch screen, etc
Equipment compatible product size: ≤ 800mm × 600 mm, applicable to etching of 21 inch wide materials and below capacitive touch screen visual area and wire area
The equipment configuration adopts a dual optical path system to realize high-speed synchronous etching of small and medium-sized touch screen lines with thin line width, which increases the etching efficiency of the equipment by 50%~80%.
The software control has the function of intelligent data blocking to meet the requirements of special-shaped typesetting, improve the use efficiency of materials, and reduce the loss of materials.
Double CCD automatic correction, various correction methods, ensure the accuracy of etching and meet customer needs;
Etching line pitch can reach below 20 microns, which can be etched with ultra-fine line width silver paste, meeting the customer's demand for narrow frame touch screen, etc
Processing materials | Silver paste, ITO, CNT, graphene, etc |
Silver glue printing thickness/uniformity | 8±2μm |
Etching line width | 30μm ~40μm(Depending on the processing material) |
Linearity | ≤±5μm |
Integrated positioning accuracy | ≤±10μm(Eliminate material printing errors) |
Repetitive machining accuracy | ≤±2μm |
Splicing accuracy | ≤10μm |
Effective absorption format | 800 mm×600 mm |
CCD alignment size | 800 mm×600 mm |
Positioning method | Double CCD automatic positioning |
Processing speed | ≤3000 mm/s (Depending on specific materials) |
Single PCS processing range | 320 mm×160 mm |
Processing materials | Silver paste, ITO, CNT, graphene, etc |
Silver glue printing thickness/uniformity | 8±2μm |
Etching line width | 30μm ~40μm(Depending on the processing material) |
Linearity | ≤±5μm |
Integrated positioning accuracy | ≤±10μm(Eliminate material printing errors) |
Repetitive machining accuracy | ≤±2μm |
Splicing accuracy | ≤10μm |
Effective absorption format | 800 mm×600 mm |
CCD alignment size | 800 mm×600 mm |
Positioning method | Double CCD automatic positioning |
Processing speed | ≤3000 mm/s (Depending on specific materials) |
Single PCS processing range | 320 mm×160 mm |