The equipment is configured with a dual-X-axis asynchronous etching optical path system. Each set of X-axis is independently configured with a set of optical path system. The dual-heads can conduct independent zoning etching according to the actual situation to achieve high-speed asynchronous etching of 86 inch touch screen lines with thin line width.
The processing efficiency has been significantly improved, and the efficiency has been nearly doubled.
Positioning method: each set of X-axis is equipped with a visual correction system, which automatically calculates the position deviation of the membrane material, and the efficiency of grasping the mark is further improved.
The equipment is configured with a dual-X-axis asynchronous etching optical path system. Each set of X-axis is independently configured with a set of optical path system. The dual-heads can conduct independent zoning etching according to the actual situation to achieve high-speed asynchronous etching of 86 inch touch screen lines with thin line width.
The processing efficiency has been significantly improved, and the efficiency has been nearly doubled.
Positioning method: each set of X-axis is equipped with a visual correction system, which automatically calculates the position deviation of the membrane material, and the efficiency of grasping the mark is further improved.
Processing materials | Silver paste, ITO, CNT, graphene, etc |
Silver glue printing thickness/uniformity | 8±2μm |
Etching line width | 30μm ~40μm(Depending on the processing material) |
Linearity | ≤±5μm |
Integrated positioning accuracy | ≤±10μm(Eliminate material printing errors) |
Repetitive machining accuracy | ≤±2μm |
Splicing accuracy | ≤10μm |
Effective absorption format | 1320 mm×2190 mm |
CCD alignment size | 1320 mm×2190 mm |
Positioning method | Double CCD automatic positioning |
Processing speed | ≤8000 mm/s (Depending on specific materials) |
Single PCS processing range | 170 mm×170 mm |
Processing materials | Silver paste, ITO, CNT, graphene, etc |
Silver glue printing thickness/uniformity | 8±2μm |
Etching line width | 30μm ~40μm(Depending on the processing material) |
Linearity | ≤±5μm |
Integrated positioning accuracy | ≤±10μm(Eliminate material printing errors) |
Repetitive machining accuracy | ≤±2μm |
Splicing accuracy | ≤10μm |
Effective absorption format | 1320 mm×2190 mm |
CCD alignment size | 1320 mm×2190 mm |
Positioning method | Double CCD automatic positioning |
Processing speed | ≤8000 mm/s (Depending on specific materials) |
Single PCS processing range | 170 mm×170 mm |