Asynchronous Double-galvanometer Laser Etching Machine RZ-86DH-2
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Asynchronous Double-galvanometer Laser Etching Machine RZ-86DH-2

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The equipment is configured with a dual-X-axis asynchronous etching optical path system. Each set of X-axis is independently configured with a set of optical path system. The dual-heads can conduct independent zoning etching according to the actual situation to achieve high-speed asynchronous etching of 86 inch touch screen lines with thin line width.


The processing efficiency has been significantly improved, and the efficiency has been nearly doubled.


Positioning method: each set of X-axis is equipped with a visual correction system, which automatically calculates the position deviation of the membrane material, and the efficiency of grasping the mark is further improved.




Processing materials

Silver paste, ITO, CNT, graphene, etc

Silver glue printing thickness/uniformity

8±2μm

Etching line width

30μm ~40μm(Depending on the processing material)

Linearity

≤±5μm

Integrated positioning accuracy

≤±10μm(Eliminate material printing errors)

Repetitive machining accuracy

≤±2μm

Splicing accuracy

≤10μm

Effective absorption format

1320 mm×2190 mm

CCD alignment size

1320 mm×2190 mm

Positioning method

Double CCD automatic positioning

Processing speed

≤8000 mm/s (Depending on specific materials)

Single PCS processing range

170 mm×170 mm


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