The equipment is easy to use, operate and maintain, beautiful in appearance, compact in structure, stable and reliable in operation, and excellent in after-sales service.
Compatible product size: 1320mm * 2190mm;
The equipment is configured with A+B dual optical path system, set A is equipped with infrared laser specially used for silver slurry line etching, set B is equipped with ultraviolet laser specially used for visible area line etching, which can realize high-speed synchronous etching of 86 inch touch screen line with thin line width, and is specially used for excitation light etching processing of double-sided coating materials..
Positioning mode: CCD correction system automatically calculates the position deviation of film material.
Processing materials | Silver paste, ITO, CNT, graphene, etc |
Silver glue printing thickness/uniformity | 8±2μm |
Etching line width | 30μm ~40μm(Silver Paste) 15μm ~22μm(ITO) |
Linearity | ≤±5μm |
Integrated positioning accuracy | ≤±10μm(Eliminate material printing errors) |
Repetitive machining accuracy | ≤±2μm |
Splicing accuracy | ≤10μm |
Effective absorption format | 1320 mm×2190 mm |
CCD alignment size | 1320 mm×2190 mm |
Positioning method | Double CCD automatic positioning |
Processing speed | ≤8000 mm/s (Depending on specific materials) |
Single PCS processing range | 150 mm×150 mm |

