The equipment is easy to use, operate and maintain, beautiful in appearance, compact in structure, stable and reliable in operation, and excellent in after-sales service.
Compatible product size: 1320mm * 2190mm;
The equipment is configured with A+B dual optical path system, set A is equipped with infrared laser specially used for silver slurry line etching, set B is equipped with ultraviolet laser specially used for visible area line etching, which can realize high-speed synchronous etching of 86 inch touch screen line with thin line width, and is specially used for excitation light etching processing of double-sided coating materials..
Positioning mode: CCD correction system automatically calculates the position deviation of film material.
The equipment is easy to use, operate and maintain, beautiful in appearance, compact in structure, stable and reliable in operation, and excellent in after-sales service.
Compatible product size: 1320mm * 2190mm;
The equipment is configured with A+B dual optical path system, set A is equipped with infrared laser specially used for silver slurry line etching, set B is equipped with ultraviolet laser specially used for visible area line etching, which can realize high-speed synchronous etching of 86 inch touch screen line with thin line width, and is specially used for excitation light etching processing of double-sided coating materials..
Positioning mode: CCD correction system automatically calculates the position deviation of film material.
Processing materials | Silver paste, ITO, CNT, graphene, etc |
Silver glue printing thickness/uniformity | 8±2μm |
Etching line width | 30μm ~40μm(Silver Paste) 15μm ~22μm(ITO) |
Linearity | ≤±5μm |
Integrated positioning accuracy | ≤±10μm(Eliminate material printing errors) |
Repetitive machining accuracy | ≤±2μm |
Splicing accuracy | ≤10μm |
Effective absorption format | 1320 mm×2190 mm |
CCD alignment size | 1320 mm×2190 mm |
Positioning method | Double CCD automatic positioning |
Processing speed | ≤8000 mm/s (Depending on specific materials) |
Single PCS processing range | 150 mm×150 mm |
Processing materials | Silver paste, ITO, CNT, graphene, etc |
Silver glue printing thickness/uniformity | 8±2μm |
Etching line width | 30μm ~40μm(Silver Paste) 15μm ~22μm(ITO) |
Linearity | ≤±5μm |
Integrated positioning accuracy | ≤±10μm(Eliminate material printing errors) |
Repetitive machining accuracy | ≤±2μm |
Splicing accuracy | ≤10μm |
Effective absorption format | 1320 mm×2190 mm |
CCD alignment size | 1320 mm×2190 mm |
Positioning method | Double CCD automatic positioning |
Processing speed | ≤8000 mm/s (Depending on specific materials) |
Single PCS processing range | 150 mm×150 mm |